1 single compression contact: board-to-board (btb) series 70-9155 designers for ruggedized connectors to meet harsh environments continue to look for new products which will reduce size and cost without jeopardizing performance. the new ultra-low profile (ulp) compression contact from avx surface mounts to a pcb and provides a reliable compression connection to the mating board, even under extreme shock and vibration applications. with over 20 years of 1-piece compression contact experience, this innovative contact offers full connector performance functionality at the individual contact level. thus, allowing single contacts to be placed in any location or position on a pcb. the high force beryllium copper contact is gold plated to maximize reliability and signal integrity. the current offering has two contacts with nominal heights of 1.0mm and 1.5mm. add in the ?z? axis tolerance range and the compressed height covers 0.75mm up to 1.75mm. the contacts are supplied in tape and reel for easy smt placement. electrical ? current rating: 3 amps ? voltage rating: based on place- ment distance 9155 series 70 prefix 001 number of ways how to order 6xx contact description environmental ? operating temperature: -40oc to +125oc mechanical ? contact material: beryllium copper ? contact plating: gold over nickel ? durability: 50, 500 and 1000 cycles features and benefits ? reliable gold plated beryllium copper contacts for high cycle life and signal integrity up to 1000 cycles ? tape and reel packaged for automated smt placement ? sweeping beam design for pluggable/module applications ? three gold plating options to match end product environmental or expected life requirements applications ? industrial/ruggedized handheld or portable devices ? btb connection for any traditional power or signal application ? ground connections between pcb?s or housings code nominal contact operating operating height height range 610 1.00mm 0.75mm to 1.25mm 615 1.50mm 1.25mm to 1.75mm 00x contact description code gold description availability thickness 004 0.1m nickel under plate, gold on nose standard tin on remainder 006 0.4m nickel under plate, gold on nose special tin on remainder order 008 0.8m nickel under plate, gold on nose special tin on remainder order
2 70-9155-001-610-006 nominal working height 1.00mm notes: 1. 9155 low profile contact, working height 0.75mm 5to 1.25mm. 2. for full details refer to product specification 201-01-153 and applications notes 201-01-154. 3. material: copper alloy 0.2mm thick. 4. plating: nickel all over with gold on contact nose and tin on the remainder. parts to be packed in tape and reel. qty per reel 3000. 5. outline of connector, orientation end ?a?. 6. area to kept free of solder resist, further information in application notes. 7. area between pads to be kept clear of tracks and components. 8. smt pads plated tin. 9. mating pad plated gold over nickel. fully deflected contact suggested mating pcb layout suggested smt pcb layout packing details single compression contact: board-to-board (btb) series 70-9155
3 70-9155-001-610-006 nominal working height 1.50mm notes: 1. 9155 low profile contact, working height 0.75mm 5to 1.25mm. 2. for full details refer to product specification 201-01-153 and applications notes 201-01-154. 3. material: copper alloy 0.2mm thick. 4. plating: nickel all over with gold on contact nose and tin on the remainder. parts to be packed in tape and reel. qty per reel 3000. 5. outline of connector, orientation end ?a?. 6. area to kept free of solder resist, further information in application notes. 7. area between pads to be kept clear of tracks and components. 8. smt pads plated tin. 9. mating pad plated gold over nickel. fully deflected contact suggested mating pcb layout suggested smt pcb layout packing details single compression contact: board-to-board (btb) series 70-9155
|
